Our Services
We Mean Business
By specializing in OSAT and minimal fab services, GIDC aims to provide a comprehensive solution for your OSAT and high-mix low-volume fabrication needs.
It combines expertise in assembly, packaging, testing, and fabrication to deliver tailored solutions for its clients, catering to specific requirements, cost considerations, and niche markets.
OSAT Services
GIDC offers a wide range of OSAT services, including semiconductor assembly, packaging, and testing. We have expertise in handling various packaging technologies, such as flip-chip, wire bonding, advanced packaging, and system-in-package (SiP). Our company also has specialized equipment, cleanroom facilities, and skilled technicians to handle the intricacies of semiconductor packaging processes.
Minimal Fab Services
Our company operates a minimal fab, which is a scaled-down semiconductor fabrication facility. The minimal fab is designed to provide cost-effective manufacturing capabilities for certain applications, niche markets, or research and development purposes. Our company focuses on producing integrated circuits (ICs) with relatively simple designs and older technology nodes. It may offer limited capacity but can still cater to low-volume production, prototyping, or specialized requirements.
Rely on Expertise
Our company possesses in-depth knowledge and expertise in semiconductor assembly, packaging, testing, and fabrication processes.
We stay up-to-date with the latest advancements in packaging technologies, industry trends, and best practices.
GIDC invests in research and development activities to continually enhance its capabilities and offer cutting-edge solutions to clients.